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Tantalum Aluminum (Ta/Al) Sputtering Target

Reference: HTST373

Condition: New product

Tantalum Aluminum (Ta/Al) Sputtering Target is used for PVD thin-film deposition in semiconductor, optical, display and coating research. Heeger Materials supports custom composition, purity, target diameter, thickness, density, backing plate and bonding requirements.

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Inquiry

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Data sheet

Shape	Disc/Rectangular/Tube
Bonding	Unbonding/Bonding
Symbol	Ta/Al
Purity	99.9% - 99.95%

More info

HM provides high-quality Tantalum Aluminum Sputtering Target for research and industry purposes at competitive prices. We can provide Tantalum Aluminum Sputtering Target with different purity, size, and density according to your requirements.

High purity and density
Low particle
Uniform film thickness distribution
High efficiency in the use

Can Ta/Al target composition be customized?

Yes. Provide the desired atomic or weight ratio, purity requirement and sputtering system size for review.

Is target bonding available?

Bonding and backing plate options can be quoted with the target dimensions, backing material and operating conditions.

Tantalum Aluminum Sputtering Target Dimensions

Circular Sputtering Targets

Diameter

1.0”

2.0”

3.0”

4.0”

5.0”

6.0”

up to 21”

Rectangular Sputtering Targets

Width x Length

5” x 12”

5” x 15”

5” x 20”

5” x 22”

6” x 20”

Thickness

0.125”, 0.25”

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Material	Tantalum aluminum alloy target
CAS	Not applicable for custom alloy sputtering target
Purity	Custom target purity and composition by request
Form	Planar sputtering target, bonded or unbonded
Packaging	Vacuum-sealed packaging with target protection and documentation options

Tantalum Aluminum Sputtering Target Applications

Tantalum Aluminum Sputtering Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.

PVD thin-film deposition and coating development
Semiconductor, display and optical coating research
Custom alloy film development and production trials

Tantalum Aluminum Sputtering Target Delivery and Packaging

The Lead time of the Tantalum Aluminum Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.

Inquiry to Heeger Materials

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