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SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder

Reference: SP-1820

Condition: New product

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder is an alloy powder composed of tin (Sn), silver (Ag), and copper (Cu), which is widely used in various soldering applications. The average particle size is 0.5-2um. We can also customize the ratio of the element contents and particle size according to customers' requirements.

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Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Data sheet

Particle Size	0.5-2μm, or customized
Molecular Formula	Sn-0.3Ag-0.7Cu, Sn-3.0Ag-0.5Cu

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SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder provides reliable solder joints with good wetting characteristics, ensuring proper electrical and mechanical connections. Heeger Materials (HM) can provide high-quality SAC series Spherical Lead-Free Alloy Powder at a competitive price.

SAC (Sn-Cu-Ag) Spherical Lead-Free Solder Powder

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder Specifications

Product	Average Particle Size (μm)	Melting Point (℃)	Chemical Composition (wt%)
HM-SAC0307	1.00-2.00	224-226	Sn-0.3Ag-0.7Cu
HM-SAC305	1.00-2.00	217-219	Sn-3.0Ag-0.5Cu

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder Properties

SAC305 (Sn-3.0Ag-0.5Cu) Spherical Lead-Free Solder Powder SEM

High powder sphericity
Uniform particle size
Good dispersibility
Low oxygen content

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder Applications

Used for surface mount.
Used in semiconductor packaging and other processes.

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder Storage and Packing

SAC (Sn-Ag-Cu) Spherical Lead-Free Solder Powder should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period of time. We offer vacuum-sealed packaging options including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or we can provide customized packaging as per your specific requirements.

Packing

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