2. Products
  3. Powder
  4. Spherical Powder
  5. Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder

Viewed products

Spherical Powder

SBA4257 (42Sn-57Bi-1.0Ag) Spherical Lead-Free Solder Powder View larger

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder

SP-1821

New product

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder is an alloy powder composed of tin (Sn), bismuth (Bi), and silver (Ag), which is widely used in various soldering applications. The average particle size is 1-2 μm. We can also customize the ratio of the element contents and particle size according to customers' requirements. 

More details

Inquiry

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Secure payment methods

Data sheet

Particle Size1-2μm, or customized
Molecular Formula42Sn-57Bi-1.0Ag

More info

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder Selection Notes

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder belongs to the spherical powder range and is selected for controlled particle size distribution, high sphericity, flowability and chemistry suitable for powder processing. It is commonly used in formulation, sintering, coating, filler, catalyst, electronic material and research use as well as additive manufacturing, thermal spraying, powder metallurgy, laser cladding, research and specialty alloy development. When requesting a quote, confirm purity, particle size distribution, morphology, surface treatment, packaging and quantity.

Related Materials and Product Forms

For material comparison or adjacent product forms, browse spherical powder, powder materials, thermal spray powder and spherical powder.

FAQ

Which powder specifications are needed for a quote? Please provide purity, particle size distribution, morphology, surface treatment, packaging, quantity and the intended process such as sintering, coating, filler use or research.

This product is currently unavailable. Please check other products. Thank you.

SBA4257 (42Sn-57Bi-1.0Ag) Spherical Lead-Free Solder Powder provides reliable solder joints with good wetting characteristics, ensuring proper electrical and mechanical connections. Heeger Materials (HM) can provide high-quality SBA4257 Spherical Lead-Free Solder Powder at a competitive price.

Bismuth -Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder Specifications

Product

Average Particle Size (μm)

Melting Point (℃)

Chemical Composition (wt%)

HM-SBA4257

1.00-2.00

139-141

42Sn-57Bi-1.0Ag

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder Properties

SBA4257 (42Sn-57Bi-1.0Ag) Spherical Lead-Free Solder Powder SEM

  • High powder sphericity
  • Uniform particle size
  • Good dispersibility
  • Low oxygen content

Bismuth-Tin-Silver (42Sn-57Bi-1.0Ag) Spherical Powder Applications

  • Used for surface mount.
  • Used in semiconductor packaging and other processes.

SBA4257 Spherical Lead-Free Solder Powder Storage and Packing

SBA4257 (42Sn-57Bi-1.0Ag) Spherical Lead-Free Solder Powder should be stored in a sealed container in a dry and cool place, and should not be exposed to air for an extended period of time. We offer vacuum-sealed packaging options including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or we can provide customized packaging as per your specific requirements.

Packing

Inquiry to Heeger Materials

Items marked with an asterisk (*) are required.
Please include item quantity, size and purity.
Privacy Information:

Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy

30 other products in the same category: