Copper (Cu) Sputtering Target can be...
Copper (Cu) Sputtering Target can be use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Heeger Materials (HM) specializes in producing high purity Copper (Cu) Sputtering Targets with the highest possible density and the lowest prices.
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|Purity||99.9% - 99.999%|
Copper is a reddish metal which often used as the backing plate for sputtering target. Most of the copper and copper alloy is used for electrical equipment; construction, such as roofing and plumbing; industrial machinery, such as heat exchangers and alloys. The antomic mass of Copper is 63.546 amu and the melting point is 1083.0 °C (1356.15 K, 1981.4 °F). The density is 8.96 and the crystal is Cubic. Besides sputtering target, we also can offer Copper powder, bar, sheet, foil, disc, ribbon and filaments.
We specialize in producing custom compositions for commercial and research applications and for new proprietary technologies. Other sputtering targets, evaporation sources and other deposition materials is listed by material throughout the website.
Packing: The Copper (Cu) Sputtering Target are vacuum sealed. The MSDS and Material Certification Sheets will be packed with the product.
Lead time: 2-5 weeks for sputter target, 1-2 weeks for bonding.
Please let us know the Purity and Shape you need and we'll give you feedback in 24 hours.