Since ancient times, copper has been reddish-orange with a melting point of 1,083°C, a density of 8.92 g/cc, and a vapor pressure of 10^-4 Torr at 1,017°C. It forms key alloys like brass and bronze and is an excellent conductor of heat and electricity, found in wires, coins, and electromagnets. In the vacuum industry, copper is crucial for backing plates bonded to sputtering targets and is evaporated to form layers in semiconductors, sensors, and circuit devices.

HM provides high-quality Copper Sputtering Targets at competitive prices for research and industry purposes. We can provide Copper Sputtering Target with different purity, size, and density per your requirements.

• High purity and density
• Low particle
• Uniform film thickness distribution
• High efficiency in the use

Copper Sputtering Target Specifications

Copper Sputtering Target Dimensions

Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.

Copper Sputtering Target Applications

High-purity copper targets are primarily used in display screens, touch screens, protective films, solar energy absorption layers, and semiconductor wiring. The grains of high-purity copper targets are difficult to crush, so we achieve a fine, uniform microstructure through extensive deformation, controlling grain growth. This ensures a lower erosion rate during sputtering and reduces the sensitivity to particle formation in the sputtering process.

Copper Sputtering Target Delivery and Packaging

The Lead time of the Copper Sputtering Target is 2-5 weeks. It will be packaged in a vacuum-sealed plastic bag with a moisture barrier. The MSDS and COA will be packed with the product.

Customized Sputtering Targets

Heeger Materials specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. Other magnetron sputtering targets, evaporation sources, and deposition materials are listed by material throughout the website.