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Molybdenum Copper Alloy, MoCu Alloy

HTMO1098

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Molybdenum copper alloy is used as a heat sink material due to its high thermal conductivity. The properties of these two alloys are similar, and the density of the molybdenum-copper alloy is less than that of the tungsten-copper alloy. Good electrical conductivity, good thermal conductivity, and small thermal expansion.

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Data sheet

Materials Mo85Cu15, Mo80Cu20, Mo70Cu30, Mo60Cu40, Mo50Cu50, Mo40Cu60

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Molybdenum copper (MoCu) alloy is a composite material of molybdenum and copper which has an adjustable thermal expansion coefficient and thermal conductivity. It has lower density yet higher CTE compared with copper tungsten. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Molybdenum copper alloy combines the advantages of copper and molybdenum, high strength, high specific gravity, high-temperature resistance, arc ablation resistance, good electrical conductivity and heating performance, and good processing performance.

MoCu Alloy SheetsMoCu Alloy with coating

Molybdenum Copper Alloy Materials

Material

Mo Content

Cu Content

Density

Thermal Conductivity

25

CTE

25

Wt%

Wt%

g/cm3

W/M∙K

(10-6/K)

Mo85Cu15

85±1

Balance

10

160-180

6.8

Mo80Cu20

80±1

Balance

9.9

170-190

7.7

Mo70Cu30

70±1

Balance

9.8

180-200

9.1

Mo60Cu40

60±1

Balance

9.66

210-250

10.3

Mo50Cu50

50±0.2

Balance

9.54

230-270

11.5

Mo40Cu60

40±0.2

Balance

9.42

280-290

11.8

Molybdenum Copper Alloy Applications

Molybdenum copper alloys are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages, crystal carriers for solid-state lasers, etc.

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