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CIGS Cu(In,Ga)Se2 semiconductor...
HTHP651
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CIGS Cu(In,Ga)Se2 semiconductor material is supplied for thin-film photovoltaic, electronic and research applications. Custom composition, purity, target or powder form, dimensions and documentation are available.
In Stock
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Availability date: 03/01/2013
| Symbol | Cu.InxGa1-xSe2 |
| Purity | 99.99%-99.999% (4N-5N) |
| Size | lump |
| Product | CIGS |
| CAS | NA |
CIGS material is selected by Cu/In/Ga/Se ratio, purity, form, particle size or target dimensions, density and deposition process.
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What should be included in a quote request? Specify composition, purity, form, particle size or dimensions, density, backing plate needs, process and quantity.
Can specifications and packaging be customized? Yes. Share technical requirements, quantity, documentation and packaging needs.
High-purity and ultra-high purity CIGS (Cu.InxGa1-xSe2) materials are crucial components for the research, development, and production of advanced technologies which require optimum properties, performance, and quality.
Copper indium gallium (di)selenide (CIGS) is a I-III-VI2 semiconductor material composed of copper, indium, gallium, and selenium. The material is a solid solution of copper indium selenide (often abbreviated "CIS") and copper gallium selenide. It has a chemical formula of CuIn(1-x)Ga(x)Se2 where the value of x can vary from 0 (pure copper indium selenide) to 1 (pure copper gallium selenide). CIGS is a tetrahedrally bonded semiconductor, with the chalcopyrite crystal structure, and a bandgap varying continuously with x from about 1.0 eV (for copper indium selenide) to about 1.7 eV (for copper gallium selenide).
It is best known as the material for CIGS solar cells a thin-film technology used in the photovoltaic industry. In this role, CIGS has the advantage of being able to be deposited on flexible substrate materials, producing highly flexible, lightweight solar panels. Improvements in efficiency have made CIGS an established technology among alternative cell materials.
Usage:
It is crucial a component for the research, development, and production of advanced technologies.
Packing:
It is packed with dacron film, then covered with a sealed plastic film bag or in a polyethylene bottle.
Specify composition, purity, form, particle size or dimensions, density, backing plate needs, process and quantity.
Thin-film photovoltaics, semiconductor research, electronic films and PVD development.
Materials are supplied in protective packaging appropriate to the product form, with custom dimensions, quantities and documentation available on request.
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