Molybdenum discs are available in pure form or coated with materials such as Ruthenium (Ru), Rhodium (Rh), Nickel (Ni), Silver (Ag), Gold (Au), etc., using PVD or evaporation techniques. These discs serve as crucial contact materials in silicon-controlled rectifier diodes, transistors, and thyristors. With similar coefficients of thermal expansion (CTE) to silicon and moderate thermal conductivity, molybdenum is well-suited for large-area power devices that generate significant heat. Additionally, we offer Molybdenum Sputtering Targets.

Molybdenum Disc Specifications

• Size: 5-150mm diameter x 0.2-12.0mm thickness, tolerance: ±0.025mm
• Flatness: <0.005mm
• Parallelism: <0.01mm
• Roughness Ra<0.063mm
• Plating: Ru, Rh, Ni, Ag, Au, etc.
• Material: Mo, TZM, MoLa alloy         

Molybdenum Square Specifications

Molybdenum Disc/Square Applications

• Silicon Controlled Rectifiers Diodes
• Transistors
• Thyristors (GTO's)
• Heat Sink Bases in IC's, LSI’s, and Hybrid Circuits   

Molybdenum Disc/Square Packaging

Molybdenum (Mo) Disc/Square will be carefully packaged in wooden cases, supported with soft materials to prevent any movement during transportation. This ensures that the products remain securely in place throughout the packaging process.