Platelet Boron Nitride (BN) Powder, following modification treatment, not only enhances the BN content in the system but also facilitates effective stacking of BN particles, enabling multidirectional and continuous heat conduction. This effectively reduces the thermal conductivity interface resistance between the substrate and the filler, resulting in a substantial improvement in thermal efficiency. HM offers HMABN and HMBBN variants, with the HMABN series being suitable for silicone-based systems, while the HMBBN series is designed for epoxy-based systems. HM also provides specialized and customized services to meet the unique requirements of our customers.

Platelet Boron Nitride (BN) Powder Specifications

Platelet Boron Nitride (BN) Powder Features

• High thermal conductivity.
• Excellent compatibility with organic systems.
• Stable Physico-chemical properties, low dielectric.
• Low Mohs hardness (<2), conducive to the protection of precision machine.
• We can provide professional treatment technology for our clients based on their requirements.

Platelet Boron Nitride (BN) Powder SEM

Platelet Boron Nitride (BN) Powder Applications

• Thermal interface materials: thermal pads, thermal grease, thermally conductive phase change materials.
• Thermal conductivity Alumina-based CCL, printed circuit board.
• Thermal engineering plastics.

Platelet Boron Nitride (BN) Powder Packing

Platelet Boron Nitride (BN) Powder should be stored in a sealed container in a dry and cool place and not exposed to air for an extended period. We offer vacuum-sealed packaging including 100g/bag, 500g/bag, 1kg/bag, and 25kg/drum, or customized packaging as per specific requirements.