Refractory Metals

Sale!

View larger

Ion Implantation Components

Condition: New product

Ion Implantation is an important process that is widely used in semiconductor device fabrication, metal finishing, and materials science research. The components of ion implantation are often made of TZM, molybdenum, and tungsten because these materials can perform well in harsh environments. Heeger Materials offers the best Ion Implantation Components at high quality and competitive prices.

More details

Inquiry

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Data sheet

Shape	customized
Materials	W, Mo, TZM, Refractory Metals

More info

Ion implantation is a method of accelerating and embedding impurity ions into semiconductor wafers to change their electrical properties and form the desired device structures.

Ion Implantation Components

Ion Implantation Components Features

Material Compatibility	Ion implantation components are crafted from materials with high purity, excellent thermal conductivity, and resistance to harsh environments.
Precision Design	Components are meticulously engineered to ensure accurate beam alignment, uniform dose distribution, and minimal scattering effects.
Wear Resistance	Ion implantation components are coated or treated to enhance wear resistance and minimize particle generation, prolonging their operational lifespan.
Temperature Control	Efficient heat dissipation methods are integrated to maintain temperature stability during ion implantation processes, ensuring consistent results.
Customization	Ion implantation components are designed to match specific equipment configurations, implantation parameters, and semiconductor device requirements.

Ion Implantation Components Processing Accuracy Parameters

Main Materials	Processing Range	Dimensional Accuracy (mm)	Shape Accuracy (mm)	Position Accuracy (mm)	Finish (Ra, μm)
W、Mo、TZM	0.00-5.00	±0.003	0.01	0.005	0.2-0.4
W、Mo、TZM	5.01-15.00	±0.005	0.015	0.006	0.4
W、Mo、TZM	15.01-30	±0.008	0.02	0.007	0.4
W、Mo、TZM	30.01-100	±0.010	0.025	0.008	0.6
W、Mo、TZM	> 100	±0.0127	0.030	0.010	0.6

Ion Implantation Components Applications

Used to manufacture semiconductors.
Used in metal finishing for tool steel toughening and surface finishing.
Used in ion beam mixing to achieve graded interface and strengthen adhesion between immiscible material.

Ion Implantation Components Packing

Ion Implantation Components will be carefully packaged with foam padding in a carton, wooden box, or customized package to ensure minimal damage during transportation.

Inquiry to Heeger Materials

Items marked with an asterisk (*) are required.

Privacy Information:

Heeger Materials respects your privacy, and we will NOT sell or provide your personal data to other third parties, or allow them to use your personal data for their own purposes. However, we would like to send you information from time to time by mail or email about our products and special offers in addition to the interest categories you've selected above. Read our Privacy Policy